During HAL layer refactoring and new chip bringup, we have several
caps.h for each part, to reduce the conflicts to minimum. But this is
The capabilities headers will be relataive stable once completely
written (maybe after the featues are supported by drivers).
Now ESP32 and ESP32-S2 drivers are relative stable, making it a good
time to combine all these caps.h into one soc_caps.h
This cleanup also move HAL config and pin config into separated files,
to make the responsibilities of these headers more clear. This is
helpful for the stabilities of soc_caps.h because we want to make it
public some day.
The remaining 4 kB had been reserved for storing RF calibration and
BT stack state since 4e092be6. However, these features never got
implemented. If we ever need to place RF related data into RTC slow
memory, we can do this by creating a variable with RTC_NOINIT_ATTR
instead.
Closes https://github.com/espressif/esp-idf/issues/3993
1. The 2nd bootloader always call `rom_spiflash_unlock()`, but never help to clear the WEL bit when exit. This may cause system unstability.
This commit helps to clear WEL when flash configuration is done.
**RISK:** When the app starts, it didn't have to clear the WEL before it actually write/erase. But now the very first write/erase operation should be done after a WEL clear. Though the risk is little (all the following write/erase also need to clear the WEL), we still have to test this carefully, especially for those functions used by the OTA.
2. The `rom_spiflash_unlock()` function in the patch of ESP32 may (1) trigger the QPI, (2) clear the QE or (3) fail to unlock the ISSI chips.
Status register bitmap of ISSI chip and GD chip:
| SR | ISSI | GD25LQ32C |
| -- | ---- | --------- |
| 0 | WIP | WIP |
| 1 | WEL | WEL |
| 2 | BP0 | BP0 |
| 3 | BP1 | BP1 |
| 4 | BP2 | BP2 |
| 5 | BP3 | BP3 |
| 6 | QE | BP4 |
| 7 | SRWD | SRP0 |
| 8 | | SRP1 |
| 9 | | QE |
| 10 | | SUS2 |
| 11 | | LB1 |
| 12 | | LB2 |
| 13 | | LB3 |
| 14 | | CMP |
| 15 | | SUS1 |
QE bit of other chips are at the bit 9 of the status register (i.e. bit 1 of SR2), which should be read by RDSR2 command.
However, the RDSR2 (35H, Read Status 2) command for chip of other vendors happens to be the QIOEN (Enter QPI mode) command of ISSI chips. When the `rom_spiflash_unlock()` function trys to read SR2, it may trigger the QPI of ISSI chips.
Moreover, when `rom_spiflash_unlock()` try to clear the BP4 bit in the status register, QE (bit 6) of ISSI chip may be cleared by accident. Or if the ISSI chip doesn't accept WRSR command with argument of two bytes (since it only have status register of one byte), it may fail to clear the other protect bits (BP0~BP3) as expected.
This commit makes the `rom_spiflash_unlock()` check whether the vendor is issi. if so, `rom_spiflash_unlock()` only send RDSR to read the status register, send WRSR with only 1 byte argument, and also avoid clearing the QE bit (bit 6).
3. `rom_spiflash_unlock()` always send WRSR command to clear protection bits even when there is no protection bit active. And the execution of clearing status registers, which takes about 700us, will also happen even when there's no bits cleared.
This commit skips the clearing of status register if there is no protection bits active.
Also move the execute_flash_command to be a bootloader API; move
implementation of spi_flash_wrap_set to the bootloader
Goal is that multiple faults would be required to bypass a boot-time signature check.
- Also strengthens some address range checks for safe app memory addresses
- Change pre-enable logic to also check the bootloader signature before enabling SBV2 on ESP32
Add some additional checks for invalid sections:
- Sections only partially in DRAM or IRAM are invalid
- If a section is in D/IRAM, allow the possibility only some is in D/IRAM
- Only pass sections that are entirely in the same type of RTC memory region
1. use spi functions in rom
2. remove unnecessary GPIO configurations.
3. remove unnecessary dummy settings.
4. enable dummy out function
5. flash and psram have independent timing setting registers.
6. no need to set 1.9v for LDO in 80Mhz
7. set IO driver ability to 1 by default.
8. no need to use GPIO matrix on esp32s2, IO MUX is recommended
9. enable spi clock mode and IO mode settings
We fixed some flash bugs in bootloader, but for the users used the old
vrsion bootloader, they can not fix these bugs via OTA, the solution is
add these updates in app startup.
These updates include:
1. SPI flash gpio matrix and drive strength configuration
2. SPI flash clock configuration
3. SPI flash read dummy configuration
4. SPI flash cs timing configuration
5. Update flash id of g_rom_flashchip
Using xxx_periph.h in whole IDF instead of xxx_reg.h, xxx_struct.h, xxx_channel.h ... .
Cleaned up header files from unnecessary headers (releated to soc/... headers).
When flash work in DIO Mode, in order to ensure the fast read mode of flash
is a fixed value, we merged the mode bits into address part, and the fast
read mode value is 0 (the default value).
This MR removes the common dependency from every IDF components to the SOC component.
Currently, in the ``idf_functions.cmake`` script, we include the header path of SOC component by default for all components.
But for better code organization (or maybe also benifits to the compiling speed), we may remove the dependency to SOC components for most components except the driver and kernel related components.
In CMAKE, we have two kinds of header visibilities (set by include path visibility):
(Assume component A --(depends on)--> B, B is the current component)
1. public (``COMPONENT_ADD_INCLUDEDIRS``): means this path is visible to other depending components (A) (visible to A and B)
2. private (``COMPONENT_PRIV_INCLUDEDIRS``): means this path is only visible to source files inside the component (visible to B only)
and we have two kinds of depending ways:
(Assume component A --(depends on)--> B --(depends on)--> C, B is the current component)
1. public (```COMPONENT_REQUIRES```): means B can access to public include path of C. All other components rely on you (A) will also be available for the public headers. (visible to A, B)
2. private (``COMPONENT_PRIV_REQUIRES``): means B can access to public include path of C, but don't propagate this relation to other components (A). (visible to B)
1. remove the common requirement in ``idf_functions.cmake``, this makes the SOC components invisible to all other components by default.
2. if a component (for example, DRIVER) really needs the dependency to SOC, add a private dependency to SOC for it.
3. some other components that don't really depends on the SOC may still meet some errors saying "can't find header soc/...", this is because it's depended component (DRIVER) incorrectly include the header of SOC in its public headers. Moving all this kind of #include into source files, or private headers
4. Fix the include requirements for some file which miss sufficient #include directives. (Previously they include some headers by the long long long header include link)
This is a breaking change. Previous code may depends on the long include chain.
You may need to include the following headers for some files after this commit:
- soc/soc.h
- soc/soc_memory_layout.h
- driver/gpio.h
- esp_sleep.h
The major broken include chain includes:
1. esp_system.h no longer includes esp_sleep.h. The latter includes driver/gpio.h and driver/touch_pad.h.
2. ets_sys.h no longer includes soc/soc.h
3. freertos/portmacro.h no longer includes soc/soc_memory_layout.h
some peripheral headers no longer includes their hw related headers, e.g. rom/gpio.h no longer includes soc/gpio_pins.h and soc/gpio_reg.h
BREAKING CHANGE
1. separate rom include files and linkscript to esp_rom
2. modefiy "include rom/xxx.h" to "include esp32/rom/xxx.h"
3. Forward compatible
4. update mqtt
