Enable shared stack watchpoint for overflow detection
Enable unit tests:
* "test printf using shared buffer stack" for C3
* "Test vTaskDelayUntil" for S2
* "UART can do poll()" for C3
On C3 the cache is programmatically split between Icache and dcache and with the default setup we dont leave a lot pages
available for additional mmaps into instruction space. Disabling this test for now since any hypothetical use case for this
is no longer supported "out of the box"
This reverts commit bf35ef1ce7.
It has been noticed that there are scenarios where even though firmware is not enabled
with flash encryption config feature, it should be able to write to encrypted partitions.
This revert adds the feature back which was removed around v4.0 timelines, and same
change will be backported to all releases (upto v4.0) for consistency.
- Adds arbitration between the erase and write in suspend mode
(If the flash memory is suspended then only a read operation can be performed.)
- espcoredump: Dump does not use suspend feature, just resume before continue.
- spi_flash: Add release_cpu() to do suspend/release_cpu/resume
There is no ccomp timer on C3, which means our performance tests will start
failing again due to variance caused by cache misses.
This MR adds TEST_PERFORMANCE_CCOMP_ macro that will only fail
performance test if CCOMP timer is supported on the target
* General tests like page loading from flash
* Rough test of fixed-size data types
* Rough test of blob read
* Added coverage target in cmake, also accessible
via `idf.py coverage`
* Fixed unsigned comparison in comp. enum table
* introducing temporary LINUX_TARGET define
The following three headers will be mockes:
* esp_flash.h
* esp_spi_flash.h
* esp_partition.h
* counter functions live in own header
* add spi_flash sim dir for esp_err.h to Unity
* modified gen_esp_err_to_name.py to ignore
sim/ dir in spi_flash component
Add cmock .yaml config file
Add spi hal header until soc can mock the hal
layer as well.
* add toolchain file
* add linux to preview targets
* add stub for dfu number in cmake
* excluded unity runner per default
* Added esp_attr.h and esp_partition.h linux stubs
* component.cmake check list for emptyness
* added switch for linux in unity cmake file
* Added Linux host example app
From now on, we have two tags for esp_flash tests:
- [esp_flash] for main flash chip only tests
- [esp_flash_3] for tests with external flash chips
To Run all tests, type `[esp_flash`; to run tests for main flash chip
only, type `[esp_flash].
There is a periodically yield in the esp_flash driver, to ensure the
cache will not be disabled for too long on ESP32.
On ESP32-S2 and later, we need to support more different kind of yield:
1. polling conditions, including timeout, SW read request, etc.
2. wait for events, including HW done/error/auto-suspend, timeout
semaphore, etc.
The check_yield() and yield() is separated into two parts, because we
may need to insert suspend, etc. between them.
1. The 2nd bootloader always call `rom_spiflash_unlock()`, but never help to clear the WEL bit when exit. This may cause system unstability.
This commit helps to clear WEL when flash configuration is done.
**RISK:** When the app starts, it didn't have to clear the WEL before it actually write/erase. But now the very first write/erase operation should be done after a WEL clear. Though the risk is little (all the following write/erase also need to clear the WEL), we still have to test this carefully, especially for those functions used by the OTA.
2. The `rom_spiflash_unlock()` function in the patch of ESP32 may (1) trigger the QPI, (2) clear the QE or (3) fail to unlock the ISSI chips.
Status register bitmap of ISSI chip and GD chip:
| SR | ISSI | GD25LQ32C |
| -- | ---- | --------- |
| 0 | WIP | WIP |
| 1 | WEL | WEL |
| 2 | BP0 | BP0 |
| 3 | BP1 | BP1 |
| 4 | BP2 | BP2 |
| 5 | BP3 | BP3 |
| 6 | QE | BP4 |
| 7 | SRWD | SRP0 |
| 8 | | SRP1 |
| 9 | | QE |
| 10 | | SUS2 |
| 11 | | LB1 |
| 12 | | LB2 |
| 13 | | LB3 |
| 14 | | CMP |
| 15 | | SUS1 |
QE bit of other chips are at the bit 9 of the status register (i.e. bit 1 of SR2), which should be read by RDSR2 command.
However, the RDSR2 (35H, Read Status 2) command for chip of other vendors happens to be the QIOEN (Enter QPI mode) command of ISSI chips. When the `rom_spiflash_unlock()` function trys to read SR2, it may trigger the QPI of ISSI chips.
Moreover, when `rom_spiflash_unlock()` try to clear the BP4 bit in the status register, QE (bit 6) of ISSI chip may be cleared by accident. Or if the ISSI chip doesn't accept WRSR command with argument of two bytes (since it only have status register of one byte), it may fail to clear the other protect bits (BP0~BP3) as expected.
This commit makes the `rom_spiflash_unlock()` check whether the vendor is issi. if so, `rom_spiflash_unlock()` only send RDSR to read the status register, send WRSR with only 1 byte argument, and also avoid clearing the QE bit (bit 6).
3. `rom_spiflash_unlock()` always send WRSR command to clear protection bits even when there is no protection bit active. And the execution of clearing status registers, which takes about 700us, will also happen even when there's no bits cleared.
This commit skips the clearing of status register if there is no protection bits active.
Also move the execute_flash_command to be a bootloader API; move
implementation of spi_flash_wrap_set to the bootloader
* partition api changed from spi_flash* API to
esp_partition* API and is abstracted as a C++
interface.
* The old nvs encryption is still possible
* changed default unit test app partition table
* Partitions coming from esp_partition API are
checked for generic flash encryption. If yes,
an error is returned since generic flash
encryption isn't compatible with nvs
encryption
* esp32, esp32s2 tests don't require nvs_flash
but mbedtls now
Closes IDF-1340
Closes IDF-858
* changing dependencies from unity->cmock
* added component.mk and Makefile.projbuild
* ignore test dir in gen_esp_err_to_name.py
* added some brief introduction of CMock in IDF
Sometimes the flash size read from bootloader is not correct. This may
forbid SPI Flash driver from reading the the area larger than the size
in bootloader header.
When the new config option is enabled, the latest configured
ESPTOOLPY_FLAHSIZE in the app header will be used to override the value
read from bootloader header.
Including:
1. Change the write bytes/read bytes parameter in the host driver into slicers to meet the requirements of complicated cases.
2. Refactor the esp_flash_api code a bit so that we can use the code in the ROM laster
3. Provide get_temp_buffer and release_temp_buffer in the os_functions when the buffer passed by application cannot be used directly.
4. Make timeout of operations configurable in the chip_driver.
5. Make dummy number configurable.
In commit 309376f51a, it seems like regression
was added to use ROM level API for disabling flash write protection. This
started random firmware crashes (on specific modules) with exception
`IllegalInstruction` during encrypted flash writes.
Fix here removes relevant ROM API call, since disabling flash write protection
is already ensured by caller of this API.
Closes https://github.com/espressif/esp-idf/issues/5467
Flash write operation is broken down into smaller chunk writes. Size
of this chunk was previously set to 8K but that in-turn meant cache and
non-IRAM resident interrupts could stay disabled upto ~24msec for 8K flash
write operation. If chunk size is brought down to 256 (typical flash page size)
then it brings down cache and non-IRAM interrupts disable duration to ~1msec.
Fix here keeps defaults same but provides configuration option to tweak the
setting based on application requirement.
