esp-idf/components/idf_test/integration_test/TC_IT_SYS_MISC.yml
He Yin Ling b9f7e0a1a2 test: split CI test environment:
Currently CI test environment is complicated, usually includes NIC, AP.
These devices are not used for a lot test cases. Therefore we split the
test environment, remove unnecessary devices. Then it will be easier to
create CI runners.
2018-09-05 01:45:48 +00:00

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test cases:
- CI ready: 'Yes'
ID: SYS_MISC_0101
SDK: |-
8266_NonOS
8266_RTOS
ESP32_IDF
Test App: SSC
allow fail: ''
auto test: 'Yes'
category: Function
cmd set:
- ''
- - SSC SSC1 reboot
- - R SSC1 C !!!ready!!!
execution time: 0.0
expected result: 重启成功
initial condition: None
level: Integration
module: System
steps: 系统重启
sub module: Misc
summary: test reboot function
test environment: SSC_T1_4
test point 1: basic function
test point 2: sw reboot
version: v1 (2016-8-15)
- CI ready: 'Yes'
ID: SYS_MISC_0201
SDK: |-
8266_NonOS
8266_RTOS
ESP32_IDF
Test App: SSC
allow fail: ''
auto test: 'Yes'
category: Function
cmd set:
- ''
- - SSC SSC1 ram -H
- - R SSC1 RE FREEHEAP:\d+\r\n
execution time: 0.0
expected result: |2
可以查询到一个数值
initial condition: None
level: Integration
module: System
steps: 查询空闲ram
sub module: Misc
summary: get heap size test
test environment: SSC_T1_4
test point 1: basic function
test point 2: 'get heap size '
version: v1 (2016-8-15)
- CI ready: 'No'
ID: SYS_MISC_5001
SDK: |-
8266_NonOS
8266_RTOS
Test App: SSC
auto test: 'Yes'
category: Stress
cmd set: ''
execution time: 12.0
expected result: 4.target1正常运行无异常
initial condition: None
level: Integration
module: System
steps: |-
1.target1、target2通过UART与PC相连接
2.target1的晶振为40MHz晶振烧录SDK的时候选择26MHz晶振
3.target2的GPIO PIN脚通过排线与target1的电源相连接target1与target2 GND通过排线连接
4.PC发送命令控制target2使GPIO不停的拉高拉低
sub module: Misc
summary: random reboot to confirm default init data bin will not overwrite user
config
test environment: SSC_T1_InitData
test point 1: stress
test point 2: reboot when using user defined init data bin
version: v1 (2016-8-15)