1. The 2nd bootloader always call `rom_spiflash_unlock()`, but never help to clear the WEL bit when exit. This may cause system unstability.
This commit helps to clear WEL when flash configuration is done.
**RISK:** When the app starts, it didn't have to clear the WEL before it actually write/erase. But now the very first write/erase operation should be done after a WEL clear. Though the risk is little (all the following write/erase also need to clear the WEL), we still have to test this carefully, especially for those functions used by the OTA.
2. The `rom_spiflash_unlock()` function in the patch of ESP32 may (1) trigger the QPI, (2) clear the QE or (3) fail to unlock the ISSI chips.
Status register bitmap of ISSI chip and GD chip:
| SR | ISSI | GD25LQ32C |
| -- | ---- | --------- |
| 0 | WIP | WIP |
| 1 | WEL | WEL |
| 2 | BP0 | BP0 |
| 3 | BP1 | BP1 |
| 4 | BP2 | BP2 |
| 5 | BP3 | BP3 |
| 6 | QE | BP4 |
| 7 | SRWD | SRP0 |
| 8 | | SRP1 |
| 9 | | QE |
| 10 | | SUS2 |
| 11 | | LB1 |
| 12 | | LB2 |
| 13 | | LB3 |
| 14 | | CMP |
| 15 | | SUS1 |
QE bit of other chips are at the bit 9 of the status register (i.e. bit 1 of SR2), which should be read by RDSR2 command.
However, the RDSR2 (35H, Read Status 2) command for chip of other vendors happens to be the QIOEN (Enter QPI mode) command of ISSI chips. When the `rom_spiflash_unlock()` function trys to read SR2, it may trigger the QPI of ISSI chips.
Moreover, when `rom_spiflash_unlock()` try to clear the BP4 bit in the status register, QE (bit 6) of ISSI chip may be cleared by accident. Or if the ISSI chip doesn't accept WRSR command with argument of two bytes (since it only have status register of one byte), it may fail to clear the other protect bits (BP0~BP3) as expected.
This commit makes the `rom_spiflash_unlock()` check whether the vendor is issi. if so, `rom_spiflash_unlock()` only send RDSR to read the status register, send WRSR with only 1 byte argument, and also avoid clearing the QE bit (bit 6).
3. `rom_spiflash_unlock()` always send WRSR command to clear protection bits even when there is no protection bit active. And the execution of clearing status registers, which takes about 700us, will also happen even when there's no bits cleared.
This commit skips the clearing of status register if there is no protection bits active.
Also move the execute_flash_command to be a bootloader API; move
implementation of spi_flash_wrap_set to the bootloader
Allows booting in QIO/QOUT mode or with PSRAM on ESP32-PICO-V3 and
ESP32-PICO-V3-O2 without any config changes.
Custom WP pins (needed for fully custom circuit boards) should still be compatible.
Using xxx_periph.h in whole IDF instead of xxx_reg.h, xxx_struct.h, xxx_channel.h ... .
Cleaned up header files from unnecessary headers (releated to soc/... headers).
This MR removes the common dependency from every IDF components to the SOC component.
Currently, in the ``idf_functions.cmake`` script, we include the header path of SOC component by default for all components.
But for better code organization (or maybe also benifits to the compiling speed), we may remove the dependency to SOC components for most components except the driver and kernel related components.
In CMAKE, we have two kinds of header visibilities (set by include path visibility):
(Assume component A --(depends on)--> B, B is the current component)
1. public (``COMPONENT_ADD_INCLUDEDIRS``): means this path is visible to other depending components (A) (visible to A and B)
2. private (``COMPONENT_PRIV_INCLUDEDIRS``): means this path is only visible to source files inside the component (visible to B only)
and we have two kinds of depending ways:
(Assume component A --(depends on)--> B --(depends on)--> C, B is the current component)
1. public (```COMPONENT_REQUIRES```): means B can access to public include path of C. All other components rely on you (A) will also be available for the public headers. (visible to A, B)
2. private (``COMPONENT_PRIV_REQUIRES``): means B can access to public include path of C, but don't propagate this relation to other components (A). (visible to B)
1. remove the common requirement in ``idf_functions.cmake``, this makes the SOC components invisible to all other components by default.
2. if a component (for example, DRIVER) really needs the dependency to SOC, add a private dependency to SOC for it.
3. some other components that don't really depends on the SOC may still meet some errors saying "can't find header soc/...", this is because it's depended component (DRIVER) incorrectly include the header of SOC in its public headers. Moving all this kind of #include into source files, or private headers
4. Fix the include requirements for some file which miss sufficient #include directives. (Previously they include some headers by the long long long header include link)
This is a breaking change. Previous code may depends on the long include chain.
You may need to include the following headers for some files after this commit:
- soc/soc.h
- soc/soc_memory_layout.h
- driver/gpio.h
- esp_sleep.h
The major broken include chain includes:
1. esp_system.h no longer includes esp_sleep.h. The latter includes driver/gpio.h and driver/touch_pad.h.
2. ets_sys.h no longer includes soc/soc.h
3. freertos/portmacro.h no longer includes soc/soc_memory_layout.h
some peripheral headers no longer includes their hw related headers, e.g. rom/gpio.h no longer includes soc/gpio_pins.h and soc/gpio_reg.h
BREAKING CHANGE
1. separate rom include files and linkscript to esp_rom
2. modefiy "include rom/xxx.h" to "include esp32/rom/xxx.h"
3. Forward compatible
4. update mqtt
1. Bootloader reads SPI configuration from bin header, so that the burning configuration can be different with compiling configuration.
2. Psram mode init will overwrite original flash speed mode, so that users can change psram and flash speed after OTA. 3. Flash read mode(QIO/DIO…) will not be changed in app bin. It is decided by bootloader, OTA can not change this mode.
4. Add read flash ID function, and save flash ID in g_rom_flashchip
5. Set drive ability for all related GPIOs
6. Check raise VDDSDIO voltage in 80Mhz mode
7. Add check flash ID and update settings in bootloader
8. Read flash ID once and keep in global variable
9. Read flash image header once and reuse the result
Tested cases:
1. Test new and old version of bootloader
boot Flash 20M —> app Flash 80M + Psram 80M
boot Flash 40M —> app Flash 80M + Psram 80M
boot Flash 80M —> app Flash 80M + Psram 80M
boot Flash 20M —> app Flash 80M + Psram 40M
boot Flash 40M —> app Flash 80M + Psram 40M
boot Flash 80M —> app Flash 80M + Psram 40M
boot Flash 20M —> app Flash 40M + Psram 40M
boot Flash 40M —> app Flash 40M + Psram 40M
boot Flash 80M —> app Flash 40M + Psram 40M 2. Working after esp_restart reboot.
Need to make the bootloader modular so that users can redefine its functional part.
- refactoring and moving functions to the bootloader_support component
- Changed function to `void` bootloader_utility_load_image(...);
TW19596
