Linker script generator produces build/esp32/esp32.common.ld from
components/esp32/ld/esp32.common.ld.in
This works fine until IDF is downgraded to V3.1 which uses components/esp32/ld/esp32.common.ld and
doesn't track build/esp32/esp32.common.ld at all.
At this point, the linker runs in the build/esp32 directory and "-T esp32.common.ld" picks up the
linker script generated .ld file, which causes mis-builds.
As reported on forums: https://esp32.com/viewtopic.php?f=13&t=9684&p=40105
1. When one of the COMPONENT_DIRS points to a component directory
(i.e. a directory containing component.mk, not a directory of multiple
components), and there is a subdirectory in it which also contains
a component, the subdirectory was mistakenly added to the list of
components and compiled.
For example:
main/
component.mk
main.c
test/
component.mk
test_main.c
Would compile test_main.c and link libtest.a.
2. When one of the COMPONENT_DIRS points to a component directory, and
the parent directory contained a directory with the same name as
another component, that directory would be mistakenly added to the
COMPONENT_PATHS.
For example:
esp/
esp-idf/
esp32/
(random stuff)
mycomponent/
component.mk
mycomponent.c
myproject/
main/
Makefile
and Makefile sets EXTRA_COMPONENT_DIRS=$(realpath ../mycomponent),
then "esp32" directory which is at the same level as mycomponent
was added to COMPONENT_PATHS.
3. If EXTRA_COMPONENT_DIRS pointed to a directory with a list of
components, and one of the subdirectories was not a component, but
had the same name as another component, than that directory would be
mistakenly added to COMPONENT_PATHS instead of the real esp32
component directory.
For example:
my_components/
my_component/
component.mk
my_component.c
esp32/
(some random stuff)
and EXTRA_COMPONENT_DIRS would point to my_components/, then "esp32"
directory would be added to COMPONENT_PATHS instead of the real esp32
component directory.
Added a new structure esp_app_desc_t. It has info about firmware:
version, secure_version, project_name, time/date build and IDF version.
Added the ability to add a custom structure with a description of the firmware.
The esp_app_desc_t is located in fixed place in start of ROM secotor. It is located after structures esp_image_header_t and esp_image_segment_header_t.
app_version is filed from PROJECT_VER variable (if set in custom make file) or PROJECT_PATH/version.txt or git repo (git describe).
Add API to get app_desc from partition.
With V=0, build process would print “including .../Makefile.projbuild" lines, causing problems for print_flash_cmd target.
The issue was due to the way macro expansion works in make. To delay evaluation of info function until the execution of expanded block, two dollar signs are required.
Test for print_flash_cmd target added.
Since !2190, source files located outside of the component root
produce object files inside build directory. This change fixes
handling of COMPONENT_OBJEXCLUDE variable for such files. Tests are
added.
For config-only components, component.mk should now contain "COMPONENT_CONFIG_ONLY := 1"
Also refactored some of the generation of linker paths, library list. This required cleaning up the way the bootloader
project works, it's now mostly independent from the parent.
Now the tests do not pass
Before we had incorrect code of the error code checking
in build_examples.sh for that case and did nothing in test_build_system.sh.
